该职位来源于猎聘 职责描述: PRIMARY OBJECTIVES: Be in charge of system design/general design and customer integration support for X-Ray image detection subsystem. Work as technical lead engineer in PM projects/assigned PC/TC projects and technical interface with DT BU's and customers. Coordinate system level design and development tasks including design, integration/subsystem level assembly and formal testing. 任职要求: Essential Strong design background in high reliability and high precision electronics system with at least 6 years experience within the industry. Broad technical knowledge and skills, with deep understanding in system level EMC design standard and certification, mechanical processing and subsystem assembly process. Strong application and system integration background of X-Ray detection industry. Experiences with Knowledge of X-Ray image detection system and image signal chain. Knowledge X-Ray detection application and general industrial validation standard. EMC design of PCB board level and subsystem level. Design for test or failure analysis or product engineering. Familiar with Oscilloscope & Logic Analyzer for debugging and tracking problems. Good industrial interface communication protocols knowledge. Mechanics processing, detector level assembly processing and tolerance analysis. PCB and Schematics review with EDA Tools. Digital and high precision analog circuit failure analysis, data analysis and debug. PDM system application, such as Winchill. Proven technical leadership. Desirable Good English and local language skills, deals or negotiates in both local and English languages. Excellent time management and organization skills. Knowledge in Information technology.