该职位来源于猎聘 岗位职责: 1).Develop, qualify, and optimize Solder Ball Attach (SBA) processes (e.g., ball placement, reflow, flux cleaning…) for advanced packaging (e.g., BGA, CSP, WLCSP, HBM, HBF…) 2).Investigate new solder materials (e.g., lead-free alloys, low-temperature solders) and processes to improve joint reliability and thermal performance. 3).Collaborate with material suppliers and equipment vendors to evaluate next-generation solutions (e.g., micro-bumping, laser-assisted bonding). New Process/Product Introduction: 1).Lead new process setup and oversee technical reviews during NPI phases to ensure rapid ramp-up to high-volume production.
2).Phase review management to ensure new product/process on schedule delivery. 3).Contribute to advanced packaging roadmaps (e.g., thinner dies, higher die counts, 3D NAND integration, HBM, HBF…). 岗位要求: 教育背景Education
Master's degree in Electrical Engineering, Material Science, Mechanical Design Engineering, Physics and Chemistry Engineering... 知识Knowledge
- 职位要求的信息或知识范围 :
- Be familiar with the process flow of NAND packaging, including but not limited to the process requirements and machine settings of Solder Ball Attach Related.
- Candidates with semiconductor fabrication (Fab) or advanced packaging experience are strongly preferred, with demonstrated understanding of key advanced packaging technologies including TSV, TC-NCF, MR-MUF, micro bumping and interposer. 相关工作经验Experiences 1. 3+ years of experience in semiconductor assembly process/product engineering or other related.
- Experience in new product or process technology development is a plus.
- Good English skill, both written and oral