该职位来源于猎聘 职责描述: 1.负责电镀设备开发和迭代; Responsible for ECP tool development and iterative optimization; 2.与机械、电气、软件等设计部门合作,提供设计建议和设备标准; Responsible for co-working with mechanical, electrical, software design department, to provide design suggestion and tool standard; 3.负责设备硬件和软件测试标准(Check Sheet),安装调试流程(SOP),维护保养(PM)标准文件制定和撰写; Responsible for tool hardware and software test check sheet, installation operating procedure (SOP), preventive maintenance (PM) formulate and write; 4.负责售后服务工程师培训; Responsible for tool service engineer training; 5.作为产品组技术专家牵头解决设备技术问题; As the production team expert lead to solve tool hardware technical issue。 任职要求: 1.5年以上晶圆厂(Fab)电镀设备工程师,或设备商售后服务工作经验; Over 5years working experience as Fab plating hardware engineer or tool vendor service engineer 2.掌握半导体电镀设备硬件构造,原理和系统架构为佳; Master in semiconductor plating tool Structure, mechanism and system architecture is preferred;
- 熟悉电镀工艺原理; Familiar with plating process mechanism; 4.有电气和机械相关基础知识; Expert in electrical and mechanical relevant basic knowledge; 5.有设备技术标准文件制定经验优先; Experience in tool technical standard formulate and write is preferred; 6.本科以上理工科相关专业; Bachelor degree and above, major in engineering; 7.擅长沟通并能适应一定程度加班; Good at communication and for overtime work to complete tasks on time。