该职位来源于猎聘 职责描述:
- Wire Bonding Process Development;
- Quality Assurance;
- Process Documentation;
- Cross-Functional Collaboration;
- Continuous Improvement. 任职要求:
- Education:*Bachelor;s degree in Electrical Engineering, Mechanical Engineering, Materials Science.
- Experience:
2.1 3+ years of experience in semiconductor assembly, specifically in wire bonding processes.
2.2 Hands-on experience with die attach equipment and tools.
- Soft Skills/others:
3.1 Able to communicate in English, Malay and Mandarin.