Responsibilities

Manage, prioritize, execute and communicate status of individual queue of work requests. Mindset of priority.
Report and document observed trends and issues to program managers and engineers. Lesson learn summary. Good at documentation and express issues clear.
Partner with program managers and engineers on work requests and project support needs. With mindset of proposal for issue fix.
Eager to learn new product and technology. Then intro to team.
Perform fine pitch solder and BGA rework requests.
Perform X-Ray analysis to verify result. And could read Xray result.
Able to bear pressure and be patient for issue occur.

Minimum Requirement

5+ years experience performing BGA reworks.
5+ years experience reworking surface mount components, PCB Repair, fly wire, cut trace and program SW.
Ability to read schematics and layout. Basic knowledge of Ohm's Law. Parallel and serial circuit.
Ability to read data-sheet of components and get data such as package, max temp and MLS.
Ability to perform fine pitch solder work on 01005 size component with high temp solder and high yield. And also fine pitch connector soldering and repair
Comprehensive expertise on BGA reworks and Reflow profiling. Know how to select ball size to reball. Flux and solder paste to reflow.
Familiar with test equipment such as Oscilloscopes, Multimeters, Power Supplies, and Analyzers. Ability to use DMM to measure resistance, current and voltage.
Previous experience taking apart systems and re-assembling. Very careful and strong Hanson skill.
Basic knowledge of PCB, FPC and stackup.