该职位来源于猎聘 Key Responsibilities Process Development & Optimization Develop, test, and refine PVD (sputtering and evaporation) processes to achieve desired thin-film properties, including uniformity, adhesion, and performance. Optimize process parameters for high-yield, cost-effective, and scalable manufacturing. Equipment Operation & Maintenance Commission, calibrate, and maintain PVD and related equipment to ensure reliable and repeatable operation. Partner with equipment vendors and internal teams to implement upgrades, modifications, and preventive maintenance programs. Data Analysis & Troubleshooting Perform detailed analysis of process data and film quality using advanced metrology and characterization tools. Identify root causes of equipment or process issues and implement robust corrective actions. Documentation Develop and maintain standard operating procedures (SOPs), process specifications, and qualification reports. Ensure thorough documentation of experiments, results, and process baselines for knowledge retention and traceability. Collaboration & Leadership Work closely with R&D, NPI, and manufacturing teams to enable smooth technology transfer and ramp-up. Collaborate with process and quality engineers to translate key parameters into equipment and tooling designs that maximize yield and reduce cycle time. Mentor technicians and operators, providing technical guidance and training to strengthen team capability. Quality Control & Continuous Improvement Define and maintain baseline recipes and statistical process control (SPC) systems to monitor performance. Drive continuous improvement initiatives in cycle time, yield, and cost-of-ownership metrics. Support audits and compliance with industry standards and customer requirements. Required Qualifications & Skills Education: Bachelor's or Master's or Phd's degree in Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or a related field. Experience: Bachelor 12yrs or above, MS 8 years or above, Phd 5 yrs or above of hands-on experience in PVD (sputtering/evaporation) or semiconductor manufacturing processes. Strong background in equipment integration, process development, and yield improvement. Technical Skills: Proficiency in thin-film characterization techniques (e.g., ellipsometry, XRD, SEM, profilometry). Familiarity with SPC, DOE, FMEA, and other structured problem-solving methodologies. Experience with laser marking, wafer dicing, and AOI equipment is a plus. Analytical Abilities: Strong data analysis, troubleshooting, and root cause identification skills. Communication: Excellent written and verbal communication skills; ability to translate process and quality requirements into equipment/tooling design. Collaboration: Proven ability to work cross-functionally with R&D, manufacturing, quality, and equipment engineering teams. Mindset: Self-motivated, detail-oriented, and proactive in driving continuous improvement initiatives. Preferred Qualifications Experience in high-volume semiconductor or optical component manufacturing. Strong knowledge of vacuum technology, thin-film deposition systems, and cleanroom operations. Familiarity with optical coatings, photonics, or laser-based device manufacturing. Demonstrated success in new product introduction (NPI) and scaling processes from prototype to mass production. Hands-on experience with automation, robotics, or factory integration systems (MES/SECS/GEM). ALN/AL2O3 machining, Dicing, Plating experience is required.