该职位来源于猎聘 PROFESSIONAL SKILL REQUIREMENTS 岗位专业技能要求
- Familiar with saw process, soft solder process and epoxy process. 熟悉划片工艺、Soft Solder工艺和Epoxy 工艺。
- Good known about FOL package process, flow chart, equipment & material.熟悉前段封装工艺,封装流程,设备,材料等。
- Familiar with application of automotive management tools, such as FMEA,SPC,APQP,PPAP,MSA
- 熟悉汽车管理工具的应用,如FMEA,SPC,APQP,PPAP,MSA。
- At least 3 years working experience in semiconductor FOL. 3年以上半导体前段 相关工作经验。
- Familiar with Wafer Mount &Wafer Saw & DA process. 熟悉芯片装框,芯片切割,贴片工序工艺。
- Good communication and cross-functional coordination skills. 良好的工作沟通和跨部门协调能力。 ACCOUNTABILITIES 岗位职责
- Create FMEA/Control plan/SPEC/OCAP/WI and other files. 建立FMEA/Control plan/SPEC/OCAP/WI等文件。
- Evaluate new materials and reduce production costs. 评估新材料,降低生产成本。
- The process parameters are optimized by DOE to develop a stable parameter range. 通过DOE 优化制程参数,制定稳定的参数范围。
- Cooperate with new product department to introduce new products and establish information base. 配合新产品部门导入新产品并建立信息库。
- Daily maintenance of production line yield control, analysis of data, and continuous improvement of equipment and process capabilities. 日常维护生产线良率控制,分析数据,不断提升设备和过程能力。
- Responsible for TO product Wafer Mount ,Wafer Saw, Die Attach process maintenance and development. 负责TO产品芯片装框,芯片切割,贴片工艺的维护和开发。