该职位来源于猎聘 Process Technology Development:
- Develop, qualify, and optimize WB processes for advanced packaging (e.g., BGA, CSP, WLCSP, HBM, HBF…)
- Investigate new materials (e.g., lead-free alloys, low-temperature solders) and processes to improve joint reliability and thermal performance.
- Collaborate with material suppliers and equipment vendors to evaluate next-generation solutions (e.g., micro-bumping, laser-assisted bonding). Module Excellence:
- Resolve critical technical challenges & address critical defects by using innovation & breakthrough ideas.
- Drive optimization of process flows, parameter, material, and DFM enhancements.
- Conduct DOE (Design of Experiments) to refine process parameters (temperature profiles, ball size, alignment accuracy…) for high process capability & high product performance. New Process/Product Introduction:
- Lead new process setup and oversee technical reviews during NPI phases to ensure rapid ramp-up to high-volume production.
- Phase review management to ensure new product/process on schedule delivery.
- Contribute to advanced packaging roadmaps (e.g., thinner dies, higher die counts, 3D NAND integration, HBM, HBF…). 岗位要求: 教育背景Education
Master's degree in Electrical Engineering, Material Science, Mechanical Design Engineering, Physics and
Chemistry Engineering, or other simi-conductor related field. 知识Knowledge
- 职位要求的信息或知识范围 Statement of the Informational or conceptual framework required by the Job
- Be familiar with the process flow of NAND packaging, including but not limited to the process requirements and machine settings of Molding Related.
- Demonstrated proficiency in utilizing diverse quality management methodologies and advanced data analysis software solutions.
- Candidates with semiconductor fabrication (Fab) or advanced packaging experience are strongly preferred, with demonstrated understanding of key advanced packaging technologies including TSV, TC-NCF, MR-MUF, micro bumping and interposer.
- Preference will be given to applicants with hands-on experience in HBM and HBF technologies.
相关工作经验Experiences 1.2+ years of experience in semiconductor assembly process/product engineering or other related.
- Strong knowledge of assembly processes (especially on wire bond related).
- Experience in new product or process technology development is a plus. 其他胜任力Competencies & Soft Skill
- MDI - Mindset of Disruptive Innovation
- Strong self-learning motivation, and excellent communication and teamwork skills.