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Responsibilities:

  • Responsible for selecting SiC/IGBT chips that match the power module design, including evaluating on electrical, process, and reliability related performance…
  • Responsible for review of power chip design, work with supplier on defining key parameters and leading the process control to lower early failures
  • Responsible for chip level verification test definition to find suitable chips for power module application
  • Continuously optimizing existing processes with chip suppliers, to improve chip performance/reliability and yield
  • Responsible for chip related failure analysis at development phase and support power module level failure analysis

Requirements:

  • Master or above degree in semiconductor physics, microelectronics, material or related majors.
  • 5+ years of experience in SiC MOSFET/IGBT/FRD chip design, full-cycle chip development and mass production experience are preferred, particularly in automotive applications.
  • Deep know-how on SiC MOSFET and IGBT chip structures and manufacture process.
  • Familiarity with state-of-the-art SiC MOSFET chip technology, including planar and trench designs. Work experience in fab operations is preferred
  • Willing to work in a multi-cultural team and have good communication skills

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