返回查询:Thermal Developer / 北京

Join our Team
What you will do:

  • Responsible for cooling solutions for Radio Base Station hardware.
  • Understand the requirements specifications from customer and system design, breakdown them into cooling solution level requirements.
  • Cooperate with Mechanical Designers and PCB Designers, to design cooling solutions, including climate units, fans, and heatsinks and so on.
  • To do thermal simulation for PCBs, enclosure of units and cabinets; provide analysis results of simulation and solutions for risks.
  • Study the latest thermal technologies and drive the implementation into the products.
  • Provide technical specification for outsourcing parts or units.
  • To optimize the climate units for manufacture and assembly and cooperate with engineers in global external vendors and Ericsson factories.
  • Cooperate with the R&D Center Sourcing staff dealing with external vendors in technical aspects.
  • To cooperate with the global Ericsson R&D designers, including but not limit to system design, radio & digital design, mechanical & thermal design, power design.
  • To do the root causes analysis of design & quality troubles and provide solutions.
  • To create innovative techniques and cooling solutions.
  • Establish, develop and continue to improve of design environment and ways of working for thermal design within the R&D Center.

The skills you bring:

  • Master degree or above in Thermal Engineering or equivalent.
  • Excellent theory knowledge of thermal theory and engineering, including calculation and simulation skills.
  • Excellent knowledge of computer assistant simulation tools such as Icepak or Flotherm.
  • Be proactive and accountable, result-oriented.
  • Has logic mind and good at analysis.
  • Good communication skills, think on others' foot and willing to influence others.
  • Fluent oral & written English.
  • Good knowledge within Mechanical area.
  • Good sense of material cost and manufactures process. (Preferred)
  • Good knowledge within the EMC area. (Preferred)
  • Research experience related to thermal/cooling design. (Preferred)
  • Good knowledge of DFM( Design for manufacture) and DFA( Design for Assembly). (Preferred)
  • Good understanding of telecom industry standards and key testing criteria. (Preferred)
  • Basic knowledge of Wireless Communication systems. (Preferred)