该职位来源于猎聘 岗位职责: 1)Collaborate with cross-functional teams to identify opportunities for data-driven insights in assembly process. 2)Assist in the development of kanban and intelligent systems 3)Digital transformation: Build a digital twin model of the packaging production line, use sensors and IoT platforms to collect process parameters in real time, and achieve process monitoring and abnormal warning. 4)AI/machine learning optimization: Based on big data and machine learning algorithms, predict and adaptively adjust process parameters to improve yield and reduce costs. 岗位要求: 1)Master's degree or above (fresh graduates), with majors including microelectronics, materials science, mechanical engineering, automation, etc; 2)Professional knowledge: Understand the semiconductor packaging process flow, material characteristics, and reliability testing; 3)Software skills: Proficient in using CAD/layout software (AutoCAD, Mentor Graphics), simulation tools (HFSS, CST, ANSYS), and data analysis tools (Python, MATLAB); 4)Good teamwork spirit 5)Strong self-learning motivation, good communication skill.