该职位来源于猎聘 Requirement
- Bachelor or above in technical degree or equivalent 2.10 years above relative working experience in semiconductor industry, Die Attach/Wafer Saw/Wire Bond/Molding process experienced will be preferred
- At least 5 years in section head position
- Proficient in QFN, QFP, FC/MIS package and with key process experienced
- Well experience on vendor management and project leader
- Strong Leadership, Analytical Thinking
- Fluent English both in spoken and written
- Patient with efficient communication and quick response Description:
- Plan and coordinate the engineering team to achieve engineering objectives
- Overall Lead QFN, QFN, FC/MIS package and response for all engineering solution
- Communicate changes in process, procedure and policy to subordinates to ensure compliance;
- Work with customers and production control
- Cooperate with QA engineer to solve the quality problems from customer
- Ensure compliance to SOP & procedure
- Other duties assigned by immediate superior.