返回查询:Staff Principal / 成都市

Monolithic Power Systems, Inc. (MPS) is one of the fastest growing companies in the Semiconductor industry. We are worldwide technical leaders in Integrated Power Semiconductors and Systems Power delivery architectures. At MPS, we cultivate creativity, are passionate about sustainability, and are committed to providing leading-edge products and innovation to our customers. Our portfolio of technology helps power our world ---come join our team and see how YOU can make a difference.

Summary
Job Description:
Quantitatively understand stress related failure in MPS products and find optimization by FEA in trouble-shooting, and predict stress risks in product design phase.

Responsibilities

  • Mechanical or thermal stress analysis on package level & board level;
  • Parametric analysis on ranking key impact factors for improved product reliability;
  • Provide improvement solution for IC packaging related fracture ,fatigue, warpage, interface delamination issues through FEA simulation at both early failure and long term failure stage ;
  • Classify stress related failure and accordingly the failure mechanisms;
  • Optimize device & package structure or design to mitigate cracking related failure from stress ,warpage ,material , and manufacturing perspective ;

Requirements

  • Education background : MS or PHD degree in Engineering Mechanics, engineering Materials; strong in mechanics of materials & fracture mechanics;
  • Hands-on experience of major FEA tools ( ANSYS, ABAQUS, Comsol , Icepak,Flotherm,etc. ) and modeling tools (e.g., Solidworks,ProE,etc);
  • Deep understanding of packaging materials (including soldering material, glue material ) and their engineering mechanical behaviors ;
  • Good at statistical data analysis ;
  • Good team player ,and able to perform independent research & development work;
  • 3+ years thermal-mechanical simulation Experience on one or more of these areas:
  • 1) board level solder joint fatigue life simulation ;
  • 2) big board /advanced packaging (BGA,module,chiplet )warpage simulation ;
  • 3) SMT material & mechanical reliability : process simulation and DFM/DFR ;
  • 4) *vibration simu for board level package used in AEC1 environments;
  • 5) component thermal-mechanical simulation (crack, delam ,stress shift , metal ratcheting ,etc)

Monolithic Power Systems, Inc. (MPS) is an Equal Opportunity Employer and embraces diversity in our employee population. It is the policy of MPS to provide equal opportunity to all qualified applicants and employees without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, age, disability, protected veteran status or special disabled veteran, marital status, pregnancy, genetic information, or any other legally protected status.