该职位来源于猎聘 Key Responsibilities:
- Develop, configure, and optimize Die bond/Wire bond processes.
- Assess processes, take measurements, and interpret data.
- Design, run, test and upgrade systems and processes.
- Develop best practices, routines, and innovative solutions to improve production rates and quality of output.
- Perform process simulations.
- Manage cost and time constraints.
- Perform risk assessments.
- Solve complex problems.
- Interface effectively with customers and other functional teams within Lumentum such as R&D, Product Engineering and Product Line Management to validate requirements and ensure process or technology milestones are clearly defined and achieved.
- Ensure compliance to quality assurance processes and industry best practice.
- Draft process validation report, work instruction and VI spec document and so on.
- There is a certain need for overtime work.
- Quickly deal with various process problems in the production line Skills & Qualifications:
- Bachelor's degree or above. Major in Electronics Engineering, Optoelectronics, Physics, Fiber Communication. 2.5+ years of experience with Die bond/Wire bond process in a fast-paced electronics manufacturing environment, preferably in semiconductor or opto-electronics.
- Good sense of quality, strong logical analytical capability and trouble shooting skills.
- Familiarity with the design of experiments (DOE) and statistical process control (SPC)
- Creative thinker, with strong analytical and problem solving, and project management skills.
- Ability to work in a cross-functional team and interact with all levels of management.
- Strong leadership and inter-personal, written, and oral skills.
- Experience with MRSI, ENG, Silicoon, ASM, Amicra, FT machines and K&S is preferred